The IPC/JEDEC J-STD-033D standard offers a set of uniform practices for handling, packaging, transporting, and using components that are sensitive to moisture and reflow soldering temperatures. These practices are designed to prevent damage due to the absorption of moisture or exposure to the heat of soldering, which can lead to decreased yields, reliability issues, and faulty components. When the procedures outlined in IPC/JEDEC J-STD-033D are correctly applied, they guarantee a minimum shelf life of one year from the date of sealing.